Merlin has been manufacturing HDI products for more than 15 years, firstly with mechanical drilled micro vias and subsequently laser drilled vias with an ESI 5330 Laser Drill. This is an established technology that has developed and increased in volume over the years, with the increase in demand for these products Merlin has invested in an ESI 5335 Laser Drill
The 5335 incorporates a high-power diode-pumped laser to enable efficient cutting through copper-clad laminates, with a range of parameters to deliver greater swarf / debris removal, thus achieving improved hole wall definition to aid subsequent plating processes and product reliability.
Improved productivity is also gained with operational speeds of up to three times faster than previously possible, the 5335 has a peak move speed of 14,000 points per second @ 250um spacing, greater accuracy +/- 20 um over the entire panel with holes down to 50um dia.
This is a fantastic investment for Merlin and demonstrates a continued commitment to invest in the technologies required to service a developing and demanding circuit board industry at the highest level.